US 11,887,910 B2
Electronic power module
Kremena Vladimirova, Grenoble (FR); Jean-Christophe Crebier, Bevenais (FR); and Julie Widiez, Grenoble (FR)
Assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR); and CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, Paris (FR)
Appl. No. 17/272,843
Filed by COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR); and CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, Paris (FR)
PCT Filed Sep. 2, 2019, PCT No. PCT/FR2019/052014
§ 371(c)(1), (2) Date Mar. 2, 2021,
PCT Pub. No. WO2020/049245, PCT Pub. Date Mar. 12, 2020.
Claims priority of application No. 18 57934 (FR), filed on Sep. 4, 2018.
Prior Publication US 2021/0351100 A1, Nov. 11, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/492 (2006.01)
CPC H01L 23/3735 (2013.01) [H01L 23/492 (2013.01); H01L 24/08 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/80895 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A power electronic module including:
at least one semiconductor chip comprising at least one power electronic component;
at least two metal layers between which the at least one semiconductor chip is directly secured, wherein at least a first of the at least two metal layers includes at least one first structured face disposed against the at least one semiconductor chip and comprising at least one pad formed in part of a thickness thereof; and
a first metallised support to which the at least the first of the at least two metal layers is secured by a first layer of solder.