US 11,887,877 B2
Electrostatic chuck device
Mamoru Kosakai, Tokyo (JP); Masaki Ozaki, Tokyo (JP); and Keisuke Maeda, Tokyo (JP)
Assigned to SUMITOMO OSAKA CEMENT CO., LTD., Tokyo (JP)
Appl. No. 16/649,969
Filed by SUMITOMO OSAKA CEMENT CO., LTD., Tokyo (JP)
PCT Filed Sep. 26, 2018, PCT No. PCT/JP2018/035627
§ 371(c)(1), (2) Date Mar. 23, 2020,
PCT Pub. No. WO2019/065710, PCT Pub. Date Apr. 4, 2019.
Claims priority of application No. 2017-189718 (JP), filed on Sep. 29, 2017; and application No. 2017-189719 (JP), filed on Sep. 29, 2017.
Prior Publication US 2020/0266088 A1, Aug. 20, 2020
Int. Cl. H01L 21/683 (2006.01); H01L 21/3065 (2006.01); H01L 21/67 (2006.01); H01L 21/768 (2006.01); H01J 37/32 (2006.01); H02N 13/00 (2006.01)
CPC H01L 21/6833 (2013.01) [H01J 37/32091 (2013.01); H01L 21/3065 (2013.01); H01L 21/67098 (2013.01); H01L 21/76826 (2013.01); H02N 13/00 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An electrostatic chuck device comprising:
an electrostatic chuck part having a sample placing surface on which a sample is placed and having a first electrode for electrostatic attraction;
a cooling base part placed on a side opposite to the sample placing surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and
an adhesive layer that bonds the electrostatic chuck part and the cooling base part together,
wherein the electrostatic chuck part has a recess on the adhesive layer side,
the cooling base part has a protrusion on the adhesion layer side,
a sheet resistance value of the first electrode is higher than 1.0Ω/□ and lower than 1.0×1010Ω/□, and
the adhesion layer is provided along the recess and protrusion.