US 11,887,871 B2
Substrate processing apparatus and substrate processing method
Kazushige Sano, Koshi (JP); Yuichi Tanaka, Koshi (JP); and Yoshihiro Kai, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jul. 29, 2020, as Appl. No. 16/942,018.
Claims priority of application No. 2019-140207 (JP), filed on Jul. 30, 2019.
Prior Publication US 2021/0035825 A1, Feb. 4, 2021
Int. Cl. H01L 21/67 (2006.01); H01L 21/66 (2006.01)
CPC H01L 21/67086 (2013.01) [H01L 21/67057 (2013.01); H01L 21/67248 (2013.01); H01L 22/30 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a processing tub configured to store therein a processing liquid in which multiple substrates are to be immersed;
multiple liquid supplies including a first supply line and a second supply line through which the processing liquid is supplied to an inside of a water tank of the processing tub and a first heating device and a second heating device configured to heat the processing liquid at a portion of the first and the second supply lines; and
multiple in-tank temperature sensors configured to measure a temperature of the processing liquid at multiple positions within the water tank of the processing tub,
wherein the inside of the water tank of the processing tub is divided into multiple zones, the multiple zones are arranged in an arrangement direction of the multiple substrates, and the multiple liquid supplies are arranged to discharge the processing liquid into the multiple zones, respectively, and
one or more of the in-tank temperature sensors are disposed in each of the multiple zones which are arranged in the arrangement direction of the multiple substrates,
wherein the arrangement direction is a direction in which the multiple substrates are arranged in the processing tub,
wherein the multiple zones include a first zone and a second zone, the first zone including a first group of the multiple substrates and the second zone including a second group of the multiple substrates,
wherein the first zone includes a first processing condition and the second zone includes a second processing condition, the first and second processing conditions being different and individually controlled.