US 11,887,865 B2
System and method for manufacturing a semiconductor package structure
Chenghan She, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Oct. 30, 2020, as Appl. No. 17/086,189.
Prior Publication US 2022/0139726 A1, May 5, 2022
Int. Cl. H01L 21/56 (2006.01); B29C 43/34 (2006.01); B29C 43/08 (2006.01); H01L 21/67 (2006.01); B29C 43/18 (2006.01); B29L 31/34 (2006.01); B29K 105/00 (2006.01)
CPC H01L 21/565 (2013.01) [B29C 43/18 (2013.01); B29C 43/34 (2013.01); H01L 21/568 (2013.01); H01L 21/67126 (2013.01); B29C 2043/3438 (2013.01); B29K 2105/251 (2013.01); B29L 2031/3406 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for manufacturing a semiconductor package structure, comprising:
providing a carrier and a semiconductor device disposed on the carrier;
dispensing a first molding powder having a first amount on a first region of the carrier;
controlling a second amount of a second molding powder, according to a result of weighing the second molding powder, after dispensing the first molding powder; and
dispensing the second molding powder on a second region of the carrier distinct from the first region of the carrier after controlling the second amount of the second molding powder.