US 11,887,842 B2
Spliced micro light-emitting-diode display panel
Chun-Ming Tseng, MiaoLi County (TW); Wei-Ping Lin, MiaoLi County (TW); and Gwo-Jiun Sheu, MiaoLi County (TW)
Assigned to PlayNitride Display Co., Ltd., MiaoLi County (TW)
Filed by PlayNitride Display Co., Ltd., MiaoLi County (TW)
Filed on Apr. 1, 2021, as Appl. No. 17/219,891.
Claims priority of provisional application 63/069,693, filed on Aug. 24, 2020.
Claims priority of application No. 109142527 (TW), filed on Dec. 3, 2020.
Prior Publication US 2022/0059608 A1, Feb. 24, 2022
Int. Cl. H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01)
CPC H01L 27/156 (2013.01) [H01L 33/486 (2013.01); H01L 33/62 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A spliced micro light-emitting-diode display panel, comprising:
a plurality of circuit boards, spliced with each other, wherein each of the plurality of circuit boards comprises at least one driver IC; and
a plurality of micro light-emitting-diode modules, disposed separately on each of the plurality of circuit boards and connected electrically with the at least one driver IC, wherein each of the plurality of micro light-emitting-diode modules comprises a plurality of light-emitting-diode units disposed in an array, on each of the plurality of circuit boards, the at least one driver IC drives the plurality of light-emitting-diode units of the plurality of micro light-emitting-diode modules to emit light, wherein a first gap exists between any adjacent two of the plurality of light-emitting-diode units respectively on any adjacent two of the plurality of circuit boards, and a second gap exists between any adjacent two of the plurality of light-emitting-diode units on each of the plurality of micro light-emitting-diode modules, and the first gap is smaller than the second gap,
wherein each of the plurality of micro light-emitting-diode modules further comprises:
a multilayer circuit layer, comprising a top circuit layer and a bottom circuit layer, wherein the bottom circuit layer comprises a plurality of pads;
a plurality of micro light-emitting diodes, disposed on the top circuit layer of the multilayer circuit layer, and adapted to define the plurality of light-emitting-diode units, wherein each of the plurality of light-emitting-diode units comprises three of the plurality of micro light-emitting diodes separated from each other, and an orthographic projection of each of the plurality of light-emitting-diode units on the bottom circuit layer completely overlaps within a corresponding one of the plurality of pads; and
a light-transmitting flat layer, adapted to cover the top circuit layer of the multilayer circuit layer and the plurality of micro light-emitting diodes.