US 11,887,819 B2
Systems for cooling RF heated chamber components
Jon McChesney, Fremont, CA (US); Saravanapriyan Sriraman, Fremont, CA (US); Richard A. Marsh, San Ramon, CA (US); Alexander Miller Paterson, San Jose, CA (US); and John Holland, San Jose, CA (US)
Assigned to Lam Research Corporation, Fremont, CA (US)
Filed by Lam Research Corporation, Fremont, CA (US)
Filed on Oct. 5, 2022, as Appl. No. 17/960,576.
Application 17/960,576 is a continuation of application No. 17/084,103, filed on Oct. 29, 2020, granted, now 11,495,441.
Application 17/084,103 is a continuation of application No. 15/969,583, filed on May 2, 2018, granted, now 10,825,661, issued on Nov. 3, 2020.
Application 15/969,583 is a continuation of application No. 13/292,649, filed on Nov. 9, 2011, granted, now 9,978,565, issued on May 22, 2018.
Claims priority of provisional application 61/544,799, filed on Oct. 7, 2011.
Prior Publication US 2023/0039721 A1, Feb. 9, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32522 (2013.01) [H01J 37/32082 (2013.01); H01J 37/32119 (2013.01); H01J 37/32238 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A plasma processing device comprising:
a dielectric window comprising a plasma exposed surface and an air exposed surface;
a vacuum chamber coupled with the dielectric window, wherein the vacuum chamber and the plasma exposed surface of the dielectric window cooperate to enclose a plasma processing gas, wherein the dielectric window seals an opening of the vacuum chamber;
an energy source positioned adjacent to the dielectric window, wherein the energy source transmits electromagnetic energy through the dielectric window and into the vacuum chamber such that the electromagnetic energy forms an elevated temperature region in the dielectric window and transforms at least a portion of the plasma processing gas into a plasma;
at least one air amplifier in fluid communication with the air exposed surface of the dielectric window; and
a plenum in fluid communication with the air exposed surface of the dielectric window and the at least one air amplifier to receive cooling air from the at least one air amplifier, wherein the plenum is formed as multiple segments united with one another, wherein each segment comprises at least one inlet and at least one outlet that outputs air directly into a pressure region partially surrounded by the plenum, wherein the at least one air amplifier is external to the plenum.