CPC H01G 4/232 (2013.01) [H01G 2/065 (2013.01); H01G 4/224 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01)] | 19 Claims |
1. A multilayer ceramic electronic component comprising:
a multilayer ceramic electronic component main body including a multilayer body, a first external electrode, and a second external electrode, the multilayer body including a plurality of laminated dielectric layers and a plurality of laminated internal electrode layers, and further including a first main surface and a second main surface opposed to each other in a height direction, a first side surface and a second side surface opposed to each other in a width direction orthogonal or substantially orthogonal to the height direction, and a first end surface and a second end surface opposed to each other in a length direction orthogonal or substantially orthogonal to the height direction and the width direction, the first external electrode being in a vicinity of the first end surface, and the second external electrode being in a vicinity of the second end surface;
a first metal terminal connected to the first external electrode via a bonding material; and
a second metal terminal connected to the second external electrode via a bonding material; wherein
the first metal terminal includes a first terminal main body, and a first plating film on a surface of the first terminal main body;
the second metal terminal includes a second terminal main body, and a second plating film on a surface of the second terminal main body;
the first metal terminal includes a surface connected to the first external electrode on which a first recess portion is provided such that the first terminal main body is exposed in the first recess portion;
the second metal terminal includes a surface connected to the second external electrode on which a second recess portion is provided such that the second terminal main body is exposed in the second recess portion;
the surface on which the first recess portion is provided faces the first external electrode;
the surface on which the second recess portion is provided faces the second external electrode;
the first recess portion and the second recess portion each include cavities;
an exterior material covers the multilayer ceramic electronic component main body, the bonding material, a portion of the first metal terminal, and a portion of the second metal terminal;
the first plating film is provided on a portion of the surface on which the first recess portion is provided; and
the second plating film is provided on a portion of the surface on which the second recess portion is provided.
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