US 11,887,787 B2
Multilayer ceramic electronic component including metal terminals with recess portions and mounting structure of the multilayer ceramic electronic component
Satoshi Miyauchi, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Aug. 18, 2021, as Appl. No. 17/405,061.
Claims priority of application No. 2020-156321 (JP), filed on Sep. 17, 2020.
Prior Publication US 2022/0084750 A1, Mar. 17, 2022
Int. Cl. H01G 4/232 (2006.01); H01G 2/06 (2006.01); H01G 4/224 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/232 (2013.01) [H01G 2/065 (2013.01); H01G 4/224 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component comprising:
a multilayer ceramic electronic component main body including a multilayer body, a first external electrode, and a second external electrode, the multilayer body including a plurality of laminated dielectric layers and a plurality of laminated internal electrode layers, and further including a first main surface and a second main surface opposed to each other in a height direction, a first side surface and a second side surface opposed to each other in a width direction orthogonal or substantially orthogonal to the height direction, and a first end surface and a second end surface opposed to each other in a length direction orthogonal or substantially orthogonal to the height direction and the width direction, the first external electrode being in a vicinity of the first end surface, and the second external electrode being in a vicinity of the second end surface;
a first metal terminal connected to the first external electrode via a bonding material; and
a second metal terminal connected to the second external electrode via a bonding material; wherein
the first metal terminal includes a first terminal main body, and a first plating film on a surface of the first terminal main body;
the second metal terminal includes a second terminal main body, and a second plating film on a surface of the second terminal main body;
the first metal terminal includes a surface connected to the first external electrode on which a first recess portion is provided such that the first terminal main body is exposed in the first recess portion;
the second metal terminal includes a surface connected to the second external electrode on which a second recess portion is provided such that the second terminal main body is exposed in the second recess portion;
the surface on which the first recess portion is provided faces the first external electrode;
the surface on which the second recess portion is provided faces the second external electrode;
the first recess portion and the second recess portion each include cavities;
an exterior material covers the multilayer ceramic electronic component main body, the bonding material, a portion of the first metal terminal, and a portion of the second metal terminal;
the first plating film is provided on a portion of the surface on which the first recess portion is provided; and
the second plating film is provided on a portion of the surface on which the second recess portion is provided.