US 11,887,786 B2
Ceramic electronic component
Jin Woo Kim, Suwon-si (KR); Chang Hak Choi, Suwon-si (KR); Seok Hyun Yoon, Suwon-si (KR); Ki Yong Lee, Suwon-si (KR); and Jong Myeong Jeon, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 10, 2022, as Appl. No. 17/740,769.
Claims priority of application No. 10-2021-0076761 (KR), filed on Jun. 14, 2021.
Prior Publication US 2022/0399165 A1, Dec. 15, 2022
Int. Cl. H01G 4/12 (2006.01); H01G 4/30 (2006.01); H01G 4/248 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/1227 (2013.01) [H01G 4/232 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A ceramic electronic component, comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode disposed on the body and connected to the internal electrode,
wherein the dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains,
wherein the grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent,
wherein the rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb, and
wherein the first subcomponent includes at least one of Si, Mg, and Al.