US 11,887,748 B2
Adhesive composition and coupling structure
Tomoki Morijiri, Tokyo (JP); Kengo Shinohara, Tokyo (JP); and Ayao Matsukawa, Tokyo (JP)
Appl. No. 17/907,541
Filed by Resonac Corporation, Tokyo (JP)
PCT Filed Feb. 17, 2021, PCT No. PCT/JP2021/005961
§ 371(c)(1), (2) Date Sep. 28, 2022,
PCT Pub. No. WO2021/199756, PCT Pub. Date Oct. 7, 2021.
Claims priority of application No. 2020-059927 (JP), filed on Mar. 30, 2020.
Prior Publication US 2023/0146296 A1, May 11, 2023
Int. Cl. H01B 1/22 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); H01R 11/01 (2006.01)
CPC H01B 1/22 (2013.01) [C09J 9/02 (2013.01); C09J 11/04 (2013.01); H01R 11/01 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A connected structure comprising:
a first circuit member comprising a first electrode;
a second circuit member comprising a second electrode; and
a connecting portion provided between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other,
wherein at least one of the first electrode and the second electrode comprises an outermost surface layer made of Cu,
wherein the connecting portion comprises a conductive particle comprising an outermost surface layer made of Pd or Au, and
wherein the outermost surface layer of the conductive particle has a thickness of 50 nm or less.