CPC H01B 1/22 (2013.01) [C09J 9/02 (2013.01); C09J 11/04 (2013.01); H01R 11/01 (2013.01)] | 7 Claims |
1. A connected structure comprising:
a first circuit member comprising a first electrode;
a second circuit member comprising a second electrode; and
a connecting portion provided between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other,
wherein at least one of the first electrode and the second electrode comprises an outermost surface layer made of Cu,
wherein the connecting portion comprises a conductive particle comprising an outermost surface layer made of Pd or Au, and
wherein the outermost surface layer of the conductive particle has a thickness of 50 nm or less.
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