CPC G11C 11/1695 (2013.01) [G11C 11/161 (2013.01); G11C 11/1655 (2013.01); H01L 23/552 (2013.01); H10B 61/22 (2023.02); H10N 50/01 (2023.02); H10N 50/10 (2023.02); H10N 50/80 (2023.02); H10N 50/85 (2023.02)] | 20 Claims |
1. A non-volatile memory structure comprising:
a magnetoresistive random access memory (MRAM) array comprising a plurality of MRAM devices, wherein each MRAM device of the plurality of MRAM devices comprises a bottom electrode, a magnetic tunnel junction (MTJ) pillar, and a top electrode, and each MRAM device is located between a first electrically conductive structure and a second electrically conductive structure;
a bottom magnetic shield containing-material layer located beneath each MTJ pillar, but above the first electrically conductive structure, wherein the bottom magnetic shield containing-material layer is positioned between a bottom cladding dielectric material layer and a top cladding dielectric material layer, and wherein both the bottom cladding dielectric material layer and the top cladding dielectric material layer are located between each MTJ pillar and the first electrically conductive structure; and
a top magnetic shield containing-material layer located above each MRAM device, wherein the top magnetic shield containing-material layer is positioned laterally adjacent to, but not above or below, the second electrically conductive structure.
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