US 11,887,401 B2
Display backplane, manufacturing method thereof, and full-screen fingerprint identification display device
Xueguang Hao, Beijing (CN); Hongfei Cheng, Beijing (CN); and Yongda Ma, Beijing (CN)
Assigned to Beijing BOE Technology Development Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/043,725
Filed by Beijing BOE Technology Development Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Apr. 20, 2020, PCT No. PCT/CN2020/085731
§ 371(c)(1), (2) Date Sep. 30, 2020,
PCT Pub. No. WO2020/248716, PCT Pub. Date Dec. 17, 2020.
Claims priority of application No. 201910514410.0 (CN), filed on Jun. 14, 2019.
Prior Publication US 2022/0383655 A1, Dec. 1, 2022
Int. Cl. G06K 9/00 (2022.01); G06V 40/13 (2022.01); H10K 59/65 (2023.01); H10K 59/122 (2023.01); H10K 59/124 (2023.01); H10K 71/00 (2023.01); H10K 59/12 (2023.01)
CPC G06V 40/1318 (2022.01) [H10K 59/122 (2023.02); H10K 59/124 (2023.02); H10K 59/65 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02)] 16 Claims
OG exemplary drawing
 
1. A display backplane, comprising:
a substrate;
a circuit layer disposed on a surface of the substrate;
a light emitting device layer disposed on a surface of the circuit layer away from the substrate; and
a plurality of fingerprint identification photodetectors disposed in at least one of the circuit layer and the light emitting device layer,
wherein included angles between photosensitive surfaces of the fingerprint identification photodetectors and the substrate are greater than or equal to 15° and less than or equal to 45°.