US 11,887,290 B2
Electronic component evaluation method, electronic component evaluation device, and electronic component evaluation program
Daichi Gemba, Natori (JP); and Junji Morita, Natori (JP)
Assigned to SUMIDA CORPORATION
Filed by SUMIDA CORPORATION, Tokyo (JP)
Filed on Mar. 25, 2021, as Appl. No. 17/211,953.
Claims priority of application No. 2020-076717 (JP), filed on Apr. 23, 2020.
Prior Publication US 2021/0334951 A1, Oct. 28, 2021
Int. Cl. G06T 7/00 (2017.01); G06T 7/62 (2017.01); G06T 7/70 (2017.01)
CPC G06T 7/0002 (2013.01) [G06T 7/62 (2017.01); G06T 7/70 (2017.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component evaluation method for causing a processor to execute a process, the electronic component evaluation method comprising executing on the processor the steps of:
Image-capturing an electronic component including a component body and a plurality of terminals attached tothe component body to obtain imaging data;
acquiring, with respect to at least one of the plurality of terminals, reference point information including at least one of position information and first height information of a plurality of reference points of the at least one of the plurality of terminals based on the imaging data; and
determining a state according to a shape of the electronic component based on a plurality of pieces of the reference point information,
wherein the determining of the state further includes:
creating a virtual plane based on the reference point information of at least three selected points of the plurality of reference points;
obtaining second height information based on other points of the plurality of reference points with respect tothe virtual plane as a reference plane, the other points and the at least three selected points being different;
determining whether the virtual plane is a valid plane or an invalid plane based on the second height information; and
detecting a flatness of the plurality of terminals based on the determined valid plane.