US 11,886,878 B2
Distributing power shared between an accelerated processing unit and a discrete graphics processing unit
Sukesh Shenoy, Austin, TX (US); Adam N. C. Clark, Markham (CA); and Indrani Paul, Austin, TX (US)
Assigned to Advanced Micro Devices, Inc., Santa Clara, CA (US); and ATI TECHNOLOGIES ULC, Markham (CA)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US); and ATI TECHNOLOGIES ULC, Markham (CA)
Filed on Dec. 12, 2019, as Appl. No. 16/712,891.
Prior Publication US 2021/0182066 A1, Jun. 17, 2021
Int. Cl. G06F 1/00 (2006.01); G06F 9/30 (2018.01); G06F 9/48 (2006.01); G06F 1/3203 (2019.01); G06F 9/38 (2018.01)
CPC G06F 9/30083 (2013.01) [G06F 1/3203 (2013.01); G06F 9/3877 (2013.01); G06F 9/4843 (2013.01); G06F 2009/3883 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
an integrated coprocessor comprising at least one central processing unit (CPU) core and at least one graphics processing unit (GPU) core, the integrated coprocessor being configured to generate commands for execution on a discrete coprocessor external to the integrated coprocessor; and
power distribution circuitry configured to selectively provide power to the integrated coprocessor and the discrete coprocessor based on:
characteristics of workloads executing on the integrated coprocessor and the discrete coprocessor and based on a reduced platform power limit that is lower than a platform power limit shared by the integrated coprocessor and the discrete coprocessor, wherein the power distribution circuitry is further configured to selectively provide power to one or more of the integrated coprocessor or the discrete coprocessor based on at least one of:
a power dissipation of at least one of a heat dissipation device coupled to the integrated coprocessor or a heat dissipation device coupled to the discrete coprocessor; or
a skin temperature determined for an exterior portion of the apparatus configured for contact by a user, wherein the skin temperature is determined based on at least one of:
temperature measurements taken by one or more sensors proximate to at least one of a casing or a display of the apparatus; or
activity metrics associated with one or more components of the apparatus, wherein the activity metrics indicate an amount of heat generated by the one or more components.