US 11,886,376 B2
Apparatus including reconfigurable interface and methods of manufacturing the same
Won Joo Yun, Boise, ID (US); and Sang-Hoon Shin, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Aug. 10, 2021, as Appl. No. 17/398,863.
Prior Publication US 2023/0051183 A1, Feb. 16, 2023
Int. Cl. G06F 15/78 (2006.01); G11C 7/10 (2006.01); G11C 5/02 (2006.01); G11C 5/14 (2006.01); G11C 29/02 (2006.01)
CPC G06F 15/7871 (2013.01) [G06F 15/7892 (2013.01); G11C 7/1057 (2013.01); G11C 7/1084 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A memory device, comprising:
a connector configured to communicate signals with an external circuit;
a variable output source configured to provide a variable driver voltage;
an output buffer coupled to the connector and the variable output source, the output buffer configured to generate output signals based on the variable driver voltage, wherein the output signals are sent to the external circuit through the connector;
a variable reference generator configured to provide a variable signal reference;
an input buffer coupled to the connector and the variable reference generator, the input buffer configured to receive input signals from the external circuit through the connector, wherein the input signals are received based on the variable signal reference; and
a control circuit configured to control the variable output source, the output buffer, the variable reference generator, the input buffer, or a combination thereof to selectively configuring a communication setting for signals exchanged through the connector.