US 11,886,370 B2
Sharing package pins in a multi-chip module (MCM)
Yulei Shen, Suzhou (CN); Tyrone Tung Huang, Markham (CA); and Chen-Kuan Hong, Santa Clara, CA (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US); and ATI TECHNOLOGIES ULO, Markham (CA)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US); and ATI TECHNOLOGIES ULC, Markham (CA)
Filed on May 13, 2022, as Appl. No. 17/743,848.
Prior Publication US 2023/0367730 A1, Nov. 16, 2023
Int. Cl. G06F 13/40 (2006.01); G06F 13/20 (2006.01); H01L 25/065 (2023.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01)
CPC G06F 13/4031 (2013.01) [G06F 13/20 (2013.01); H01L 23/5382 (2013.01); H01L 25/0655 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1431 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor die comprising:
an output enable register; and
logic configured to:
drive a die identifier to arbitration circuitry based on determining that a value in the output enable register indicates that access to one or more shared package pins is granted to the die, wherein each bit of the die identifier is driven serially;
assert, by the die, control over the one or more shared package pins in response to determining that the die has won arbitration based on each result bit broadcast by the arbitration circuitry in response to each bit of the die identifier.