US 11,886,358 B2
Ball grid array storage for a memory sub-system
Suresh Rajgopal, San Diego, CA (US); and Balint Fleischer, Groton, MA (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Apr. 11, 2022, as Appl. No. 17/717,452.
Application 17/717,452 is a continuation of application No. 17/127,289, filed on Dec. 18, 2020, granted, now 11,301,401.
Prior Publication US 2022/0237131 A1, Jul. 28, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 13/12 (2006.01); G06F 13/16 (2006.01); G06F 13/42 (2006.01); G06F 12/06 (2006.01); G06F 12/02 (2006.01); G06F 13/40 (2006.01)
CPC G06F 13/1668 (2013.01) [G06F 12/0246 (2013.01); G06F 12/063 (2013.01); G06F 13/4068 (2013.01); G06F 13/4221 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a ball grid array (BGA) component, wherein the BGA component includes:
a plurality of memory blocks within the BGA component; and
a BGA component controller within the BGA component and firmware within the BGA component adjacent the plurality of memory blocks within the BGA component to manage the plurality of memory blocks within the BGA component;
wherein the BGA component is included in a memory component of the apparatus.