US 11,886,122 B2
Deep etching substrates using a bi-layer etch mask
Jung-Hun Seo, Buffalo, NY (US); Yixiong Zheng, Amherst, NY (US); and Matthias Muehle, Howell, MI (US)
Assigned to FRAUNHOFER USA, INC., Plymouth, MI (US); and THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK, Amherst, NY (US)
Filed by FRAUNHOFER USA, INC., Plymouth, MI (US); and The Research Foundation for The State University of New York, Buffalo, NY (US)
Filed on Jun. 24, 2021, as Appl. No. 17/357,666.
Prior Publication US 2022/0413389 A1, Dec. 29, 2022
Int. Cl. C23C 14/04 (2006.01); G03F 7/36 (2006.01); C23C 14/06 (2006.01); C23C 14/58 (2006.01)
CPC G03F 7/36 (2013.01) [C23C 14/04 (2013.01); C23C 14/06 (2013.01); C23C 14/5873 (2013.01); B81C 2201/0146 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
providing a substrate including a carbonaceous material, the substrate having a first thermal conductivity;
depositing a first masking layer having a second thermal conductivity on at least a portion of the substrate, a ratio of the second thermal conductivity to the first thermal conductivity being less than or equal to 1:30;
depositing a second masking layer in direct contact with the first masking layer to form an etch mask; and
etching an exposed portion of the substrate using the etch mask that includes both the first masking layer and the second masking layer.
 
11. An etched substrate formed by the process comprising the steps of:
providing a substrate including a carbonaceous material, the substrate having a first thermal conductivity;
depositing a first masking layer having a second thermal conductivity on at least a portion of the substrate, a ratio of the second thermal conductivity to the first thermal conductivity being less than or equal to 1:30;
depositing a second masking layer in direct contact with the first masking layer to form an etch mask; and
etching an exposed portion of the substrates;
wherein the first masking layer has a first thickness and the second masking layer has a second thickness, and a ratio of the first thickness to the second thickness has a minimum value of about 1/30.