US 11,886,115 B1
Resin, positive photosensitive resin composition and use
Zhiguo Wang, Yantai (CN); Xuesong Jiang, Yantai (CN); Guangqiang Shao, Yantai (CN); Xinyu Qiu, Yantai (CN); Hongyin Dai, Yantai (CN); and Baohua Hu, Yantai (CN)
Assigned to YANTAI SUNERA LLC, Yantai (CN)
Filed by YANTAI SUNERA LLC, Yantai (CN)
Filed on Apr. 12, 2023, as Appl. No. 18/299,687.
Int. Cl. G03F 7/023 (2006.01); G03F 7/022 (2006.01); G03F 7/039 (2006.01); G03F 7/004 (2006.01)
CPC G03F 7/0233 (2013.01) [G03F 7/0048 (2013.01); G03F 7/022 (2013.01); G03F 7/0226 (2013.01); G03F 7/039 (2013.01)] 7 Claims
 
1. A positive photosensitive resin composition, comprising a resin, a diazonaphthoquinone compound and a solvent, wherein the resin is a combination of any one or more of polyamic acid, polyamic ester and polyimide of a segment shown in formula (1);

OG Complex Work Unit Chemistry
in the formula (1), X represents a tetravalent organic group; R1 is a hydrogen atom or a C1-10 organic group;
Y represents a bivalent organic group constituting the resin, and at least comprises a general structure formula (2):

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in the formula (2), Y1 is any one of:

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and

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and * represents a linkage position;
R2 in the formula (2) is selected from —NHCO— or —O—;
n in the formula (1) is an integer in a range of 10-100000;
the organic group in the formula (2) is derived from one or more of the following diamine b-1-1 to b-1-8:

OG Complex Work Unit Chemistry
a weight ratio of the resin to the solvent is 1:(5-80); a weight ratio of the resin to the diazonaphthoquinone compound is 100:(1-100).