US 11,886,114 B2
Photosensitive insulating paste and electronic component
Kenta Kondo, Nagaokakyo (JP); and Shimpei Tanabe, Nagaokakyo (JP)
Assigned to Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed on Aug. 17, 2020, as Appl. No. 16/995,420.
Claims priority of application No. 2019-179450 (JP), filed on Sep. 30, 2019.
Prior Publication US 2021/0096464 A1, Apr. 1, 2021
Int. Cl. C03C 8/20 (2006.01); G03F 7/004 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); G03F 7/028 (2006.01)
CPC G03F 7/0047 (2013.01) [C03C 8/20 (2013.01); G03F 7/028 (2013.01); H05K 1/0306 (2013.01); H05K 3/0023 (2013.01); H05K 3/4667 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A photosensitive insulating paste comprising:
glass frit;
a first inorganic filler;
a second inorganic filler;
an alkali-soluble polymer;
a photosensitive monomer;
a photopolymerization initiator; and
a solvent,
wherein the first inorganic filler has a refractive index of 1.7 or higher,
the second inorganic filler has a refractive index of 1.55 or lower, and
when an amount of the glass frit is denoted as A, an amount of the first inorganic filler is denoted as B, and an amount of the second inorganic filler is denoted as C, the following conditions are satisfied in the photosensitive insulating paste: A+B+C=100, B is from 5 vol % to 20 vol %, and C is from (25-B) vol % to (40-B) vol %.