US 11,886,015 B2
Recessed portion in a substrate and method of forming the same
Shao Hsuan Chuang, Kaohsiung (TW); and Huang-Hsien Chang, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Mar. 1, 2022, as Appl. No. 17/684,377.
Application 17/684,377 is a continuation of application No. 16/988,325, filed on Aug. 7, 2020, granted, now 11,262,506.
Prior Publication US 2022/0236489 A1, Jul. 28, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G02B 6/36 (2006.01); H01L 21/3065 (2006.01); G02B 6/42 (2006.01)
CPC G02B 6/3636 (2013.01) [G02B 6/3632 (2013.01); G02B 6/4243 (2013.01); H01L 21/30655 (2013.01); G02B 6/3608 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An optical device, comprising:
a semiconductor carrier having a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface, wherein a surface roughness of the profile is greater than a surface roughness of the second surface, and the second surface comprises a concave surface facing toward the first surface; and
a fiber disposed on the second surface.