US 11,885,010 B2
Process and device for producing a chalcogen-containing compound semiconductor
Joerg Palm, Munich (DE); Thomas Niesen, Deisenhofer (DE); and Erik Trabitzsch, Leipzig (DE)
Assigned to CNBM RESEARCH INSTITUTE FOR ADVANCED GLASS MATERIALS GROUP CO., LTD., Bengbu (CN)
Appl. No. 17/609,423
Filed by CNBM RESEARCH INSTITUTE FOR ADVANCED GLASS MATERIALS GROUP CO., LTD., Bengbu (CN)
PCT Filed May 6, 2020, PCT No. PCT/CN2020/088652
§ 371(c)(1), (2) Date Nov. 8, 2021,
PCT Pub. No. WO2020/224572, PCT Pub. Date Nov. 12, 2020.
Claims priority of application No. 19172672 (EP), filed on May 6, 2019.
Prior Publication US 2022/0228255 A1, Jul. 21, 2022
Int. Cl. H01L 21/02 (2006.01); C23C 14/58 (2006.01); B01D 5/00 (2006.01); C23C 14/06 (2006.01)
CPC C23C 14/5866 (2013.01) [B01D 5/006 (2013.01); B01D 5/009 (2013.01); C23C 14/0623 (2013.01); H01L 21/02568 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of producing a chalcogen-containing compound semiconductor, comprising:
providing at least one substrate coated with a precursor for the chalcogen-containing compound semiconductor in a process chamber to obtain at least one coated substrate, wherein the precursor comprises at least one metal and at least one chalcogen,
heat treating the at least one coated substrate in the process chamber, wherein during a heat treatment, a gas atmosphere comprising at least one gaseous chalcogen compound is provided in the process chamber,
removing the gas atmosphere present after the heat treatment of the at least one coated substrate as a waste gas from the process chamber,
cooling the waste gas in a gas processor below the boiling point or melting point of the chalcogen compounds in the waste gas, wherein the at least one gaseous chalcogen compound or a plurality of gaseous chalcogen compounds present in the waste gas after the heat treatment of the at least one coated substrate are separated from the waste gas in time and space by a respective conversion into a liquid or solid form.