	US 11,884,805 B2
	Sealant and sealant composition for electrochemical device
Kouichirou Maeda, Tokyo (JP)
Assigned to ZEON CORPORATION, Tokyo (JP)
Appl. No. 17/593,393
Filed by ZEON CORPORATION, Tokyo (JP)
PCT Filed Mar. 5, 2020, PCT No. PCT/JP2020/009434 § 371(c)(1), (2) Date Sep. 17, 2021, PCT Pub. No. WO2020/189306, PCT Pub. Date Sep. 24, 2020.
Claims priority of application No. 2019-053513 (JP), filed on Mar. 20, 2019.
Prior Publication US 2022/0186013 A1, Jun. 16, 2022
Int. Cl. C08L 23/22 (2006.01); H01M 50/193 (2021.01); C09K 3/10 (2006.01); H01M 50/184 (2021.01)

CPC C08L 23/22 (2013.01) [C09K 3/10 (2013.01); H01M 50/193 (2021.01); C08L 2203/20 (2013.01); C09K 2200/0607 (2013.01); C09K 2200/0617 (2013.01); H01M 50/184 (2021.01)]

3 Claims

1. A sealant for an electrochemical device comprising: (A) a polyisobutylene polymer; and (B) a conjugated diene polymer, wherein

the (A) polyisobutylene polymer is contained in a proportion of more than 84 mass % and not more than 96 mass % and the (B) conjugated diene polymer is contained in a proportion of not less than 4 mass % and less than 16 mass % relative to total mass of the (A) polyisobutylene polymer and the (B) conjugated diene polymer.