US 11,884,782 B2
Resin particles, conductive particles, conductive material and connection structure
Hiroyuki Morita, Osaka (JP); and Takeshi Wakiya, Osaka (JP)
Assigned to SEKISUI CHEMICAL CO., LTD., Osaka (JP)
Appl. No. 17/440,023
Filed by SEKISUI CHEMICAL CO., LTD., Osaka (JP)
PCT Filed Mar. 18, 2020, PCT No. PCT/JP2020/011870
§ 371(c)(1), (2) Date Sep. 16, 2021,
PCT Pub. No. WO2020/189697, PCT Pub. Date Sep. 24, 2020.
Claims priority of application No. 2019-050770 (JP), filed on Mar. 19, 2019; and application No. 2019-224683 (JP), filed on Dec. 12, 2019.
Prior Publication US 2022/0213279 A1, Jul. 7, 2022
Int. Cl. C08L 101/12 (2006.01); C08J 3/12 (2006.01); C08G 59/50 (2006.01); C08K 3/08 (2006.01); C08L 63/00 (2006.01); H01B 1/22 (2006.01); H01R 11/01 (2006.01)
CPC C08J 3/12 (2013.01) [C08G 59/50 (2013.01); C08K 3/08 (2013.01); C08L 63/00 (2013.01); H01B 1/22 (2013.01); H01R 11/01 (2013.01); C08K 2003/0862 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A resin particle having an exothermic peak observed, where differential scanning calorimetry is performed by heating the resin particle at a temperature rising rate of 5° C./min from 100° C. to 350° C. in an air atmosphere, wherein the resin particle satisfies at least one configuration selected from the group consisting of a Configuration (1) and a Configuration (2), as follows:
Configuration (1): among the exothermic peaks, an exothermic amount at the exothermic peak having the largest peak area is 2,000 mJ/mg or more and 25,000 mJ/mg or less;
Configuration (2): an absolute value of a difference between a compressive elasticity modulus where the resin particle is compressed by 10% and the compressive elasticity modulus where the resin particle heated at 200° C. for 10 minutes is compressed by 10% is 180 N/mm2 or more.