US 11,884,071 B2
Fluid ejection device with reduced number of components, and method for manufacturing the fluid ejection device
Domenico Giusti, Caponago (IT); Carlo Luigi Prelini, Seveso (IT); and Lorenzo Tentori, Verano Brianza (IT)
Assigned to STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed by STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed on Jan. 10, 2022, as Appl. No. 17/572,374.
Application 17/572,374 is a division of application No. 16/848,549, filed on Apr. 14, 2020, granted, now 11,260,659.
Claims priority of application No. 102019000005794 (IT), filed on Apr. 15, 2019.
Prior Publication US 2022/0126580 A1, Apr. 28, 2022
Int. Cl. B41J 2/14 (2006.01); B41J 2/165 (2006.01)
CPC B41J 2/14201 (2013.01) [B41J 2/1433 (2013.01); B41J 2/1652 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
forming, on a first side of a first wafer including semiconductor material, a piezoelectric actuator;
forming, in the first wafer and lateral to the piezoelectric actuator, an outlet channel;
forming a second wafer on the first wafer, the second wafer including semiconductor material, a recess, and at least one inlet channel fluidically coupled to the recess, the piezoelectric actuator being in the recess, the recess forming a reservoir configured to hold fluid;
forming a nozzle plate on a second side, opposite to the first side, of the first wafer; and
forming an ejection nozzle, at least partially aligned with the outlet channel, through the nozzle plate such that the ejection nozzle is fluidically coupled to the recess through the outlet channel.