US 11,881,612 B2
Heat dissipation sheet and electronic device including same
Seunghoon Kang, Suwon-si (KR); Jinhyoung Lee, Incheon (KR); Kyungha Koo, Suwon-si (KR); Jinmyoung Kim, Incheon (KR); Hongki Moon, Suwon-si (KR); Yoonsun Park, Suwon-si (KR); Seyoung Jang, Suwon-si (KR); and Seungjae Hwang, Incheon (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR); and Amotech Co., Ltd., Incheon (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR); and Amotech Co., Ltd., Incheon (KR)
Filed on Aug. 13, 2021, as Appl. No. 17/402,055.
Application 17/402,055 is a continuation of application No. PCT/KR2020/001586, filed on Feb. 3, 2020.
Claims priority of application No. 10-2019-0018147 (KR), filed on Feb. 15, 2019.
Prior Publication US 2021/0391636 A1, Dec. 16, 2021
Int. Cl. H01Q 1/02 (2006.01); H01Q 1/24 (2006.01)
CPC H01Q 1/02 (2013.01) [H01Q 1/24 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a front plate oriented in a first direction;
a rear plate oriented in a second direction opposite to the first direction;
at least one antenna module disposed between the front plate and the rear plate; and
at least one heat dissipation sheet spaced apart from the at least one antenna module and adhesively disposed on the rear plate, wherein the at least one heat dissipation sheet comprises:
a ceramic filler, and
a binder resin mixed with the ceramic filler.