US 11,881,544 B2
Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device
Markus Pindl, Tegernheim (DE); Thomas Schwarz, Regensburg (DE); Frank Singer, Regenstauf (DE); and Sandra Sobczyk, Regensburg (DE)
Assigned to OSRAM OLED GmbH, Regensburg (DE)
Filed by OSRAM OLED GmbH, Regensburg (DE)
Filed on Oct. 5, 2022, as Appl. No. 17/960,794.
Application 16/240,584 is a division of application No. 15/036,413, granted, now 10,217,913, issued on Feb. 26, 2019, previously published as PCT/EP2014/073369, filed on Oct. 30, 2014.
Application 17/960,794 is a continuation of application No. 17/181,458, filed on Feb. 22, 2021, granted, now 11,508,884.
Application 17/181,458 is a continuation of application No. 16/866,890, filed on May 5, 2020, granted, now 10,964,861.
Application 16/866,890 is a continuation of application No. 16/240,584, filed on Jan. 4, 2019, granted, now 10,686,104, issued on Jun. 16, 2020.
Claims priority of application No. 102013112549 (DE), filed on Nov. 14, 2013.
Prior Publication US 2023/0031493 A1, Feb. 2, 2023
Int. Cl. H01L 33/54 (2010.01); H01L 33/00 (2010.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 31/18 (2006.01); H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 21/56 (2006.01)
CPC H01L 33/54 (2013.01) [H01L 31/0203 (2013.01); H01L 31/02322 (2013.01); H01L 31/186 (2013.01); H01L 33/0095 (2013.01); H01L 33/502 (2013.01); H01L 21/568 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/56 (2013.01); H01L 2224/18 (2013.01); H01L 2224/24 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/82 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for producing a plurality of optoelectronic semiconductor devices comprising:
a) providing a plurality of semiconductor chips, which are spaced from one another in a lateral direction;
b) forming a package body assembly, which is arranged at least in part between the semiconductor chips;
c) forming a plurality of fillets, which each adjoin a semiconductor chip and which are delimited in the lateral direction by a side face of the respective semiconductor chip and the package body assembly, wherein forming the plurality of fillets is performed at least in part prior to forming the package body assembly, and wherein the fillets extend in each case around an entire circumference of the associated semiconductor chip, the fillets comprise a convex curvature when viewed from the radiation exit face, or both; and
d) singulating the package body assembly into a plurality of optoelectronic semiconductor devices, wherein each semiconductor device comprises at least one semiconductor chip and a part of the package body assembly as its package body and wherein the semiconductor chips are each free of package body material on a radiation exit face of the semiconductor device opposite a mounting surface.