US 11,881,427 B2
Substrate flipping in vacuum for dual sided PVD sputtering
Harish Penmethsa, Dublin, CA (US); Suresh Palanisamy, Coimbatore (IN); Dinesh Rajamanickam, Coimbatore (IN); and Naresh Kumar Asokan, Coimbatore (IN)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 4, 2021, as Appl. No. 17/493,283.
Prior Publication US 2023/0103481 A1, Apr. 6, 2023
Int. Cl. H01L 21/687 (2006.01); C23C 14/34 (2006.01); C23C 14/56 (2006.01); B65G 47/248 (2006.01)
CPC H01L 21/68764 (2013.01) [B65G 47/248 (2013.01); C23C 14/34 (2013.01); C23C 14/566 (2013.01); H01L 21/68728 (2013.01)] 18 Claims
OG exemplary drawing
1. A module of a processing system for flipping a substrate in vacuum, the module comprising:
a clamp assembly for securing a substrate placed in a first plane;
a first motor assembly coupled to the clamp assembly for rotating the clamp assembly around a first direction that is parallel to the first plane;
a second motor assembly coupled to the first motor assembly for raising and lowering the first motor assembly and the clamp assembly in a second direction that is perpendicular to the first plane; and
a slide coupled to the clamp assembly on a side opposite the first motor assembly in the first direction, wherein the slide comprises a bearing support that supports:
rotation of the clamp assembly by the first motor assembly around the first direction through a rotatable bearing; and
raising and lowering of the first motor assembly by the second motor assembly in the second direction.