US 11,881,423 B2
Electrostatic chuck with metal bond
Vijay D. Parkhe, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Feb. 9, 2021, as Appl. No. 17/171,916.
Prior Publication US 2022/0254670 A1, Aug. 11, 2022
Int. Cl. H01L 21/683 (2006.01); H01L 21/687 (2006.01); H01J 37/32 (2006.01)
CPC H01L 21/6833 (2013.01) [H01J 37/32082 (2013.01); H01J 37/32724 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A method of fabricating a substrate support assembly, the method comprising:
forming a ceramic bottom plate having heater elements therein;
forming a ceramic top plate having an electrode therein; and
bonding the ceramic top plate to the ceramic bottom plate with a metal layer between the ceramic top plate and the ceramic bottom plate, the ceramic top plate in direct contact with the metal layer, and the metal layer in direct contact with the ceramic bottom plate, wherein bonding the ceramic top plate to the ceramic bottom plate with the metal layer comprises heating the ceramic bottom plate, the metal layer, and the ceramic top plate to a temperature less than 600 degrees Celsius.