CPC H01L 21/6833 (2013.01) [H01J 37/32082 (2013.01); H01J 37/32724 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01)] | 5 Claims |
1. A method of fabricating a substrate support assembly, the method comprising:
forming a ceramic bottom plate having heater elements therein;
forming a ceramic top plate having an electrode therein; and
bonding the ceramic top plate to the ceramic bottom plate with a metal layer between the ceramic top plate and the ceramic bottom plate, the ceramic top plate in direct contact with the metal layer, and the metal layer in direct contact with the ceramic bottom plate, wherein bonding the ceramic top plate to the ceramic bottom plate with the metal layer comprises heating the ceramic bottom plate, the metal layer, and the ceramic top plate to a temperature less than 600 degrees Celsius.
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