CPC G01N 29/12 (2013.01) [G01N 29/07 (2013.01); G01N 29/225 (2013.01); G01N 29/2418 (2013.01); G01N 29/2437 (2013.01); G01N 29/27 (2013.01); G01N 29/46 (2013.01); G06N 20/00 (2019.01); G01N 2291/011 (2013.01); G01N 2291/023 (2013.01); G01N 2291/0289 (2013.01); G01N 2291/101 (2013.01)] | 20 Claims |
1. A method for detecting wafer defects, comprising:
exciting a wafer using an acoustic signal to cause the wafer to exhibit vibrations;
measuring one or more of linear frequency response metrics or nonlinear frequency responses metrics associated with the vibrations; and
identifying any defects in the wafer based at least in part on one or more of the linear frequency response metrics or nonlinear frequency responses metrics.
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