US 11,879,868 B2
Acoustics-based noninvasive wafer defect detection
Cristian Pantea, Los Alamos, NM (US); John James Greenhall, Santa Fe, NM (US); Alan Lyman Graham, Los Alamos, NM (US); and Dipen N. Sinha, Bay Shore, NY (US)
Assigned to TRIAD NATIONAL SECURITY, LLC, Los Alamos, NM (US)
Filed by Triad National Security, LLC, Los Alamos, NM (US)
Filed on May 14, 2021, as Appl. No. 17/321,332.
Claims priority of provisional application 63/025,144, filed on May 14, 2020.
Prior Publication US 2021/0356435 A1, Nov. 18, 2021
Int. Cl. G01N 29/12 (2006.01); G01N 29/24 (2006.01); G01N 29/07 (2006.01); G01N 29/22 (2006.01); G01N 29/27 (2006.01); G06N 20/00 (2019.01); G01N 29/46 (2006.01)
CPC G01N 29/12 (2013.01) [G01N 29/07 (2013.01); G01N 29/225 (2013.01); G01N 29/2418 (2013.01); G01N 29/2437 (2013.01); G01N 29/27 (2013.01); G01N 29/46 (2013.01); G06N 20/00 (2019.01); G01N 2291/011 (2013.01); G01N 2291/023 (2013.01); G01N 2291/0289 (2013.01); G01N 2291/101 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for detecting wafer defects, comprising:
exciting a wafer using an acoustic signal to cause the wafer to exhibit vibrations;
measuring one or more of linear frequency response metrics or nonlinear frequency responses metrics associated with the vibrations; and
identifying any defects in the wafer based at least in part on one or more of the linear frequency response metrics or nonlinear frequency responses metrics.