US 11,879,867 B2
Ultrasound testing of adhesive bonds
Pierre Belanger, Montreal (CA); and Daniel Pereira, Montréal (CA)
Assigned to ECOLE DE TECHNOLOGIE SUPERIEURE, Montreal (CA)
Filed by ECOLE DE TECHNOLOGIE SUPERIEURE, Montreal (CA)
Filed on Jun. 23, 2022, as Appl. No. 17/847,268.
Claims priority of provisional application 63/213,942, filed on Jun. 23, 2021.
Prior Publication US 2022/0412922 A1, Dec. 29, 2022
Int. Cl. G01N 29/11 (2006.01); G01N 29/28 (2006.01)
CPC G01N 29/11 (2013.01) [G01N 29/28 (2013.01); G01N 2291/0231 (2013.01); G01N 2291/044 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method for performing ultrasound testing of a component comprising a first material layer and a second material layer bonded by an adhesive layer, the method comprising:
applying input ultrasound waves to the component to cause longitudinal propagation of ultrasonic guided waves through the first material layer, the second material layer and the adhesive layer;
acquiring acoustic waves from the component, wherein the acoustic waves are produced by the longitudinal propagation of the ultrasonic guided waves;
generating a signal representation of the acoustic waves;
comparing the signal representation of the acoustic waves to a plurality of reference signals to identify a characteristic of the adhesive layer; and
outputting an output signal indicative of the characteristic of the adhesive layer.