US 11,879,686 B2
Cooling systems comprising passively and actively expandable vapor chambers for cooling power semiconductor devices
Shailesh N. Joshi, Ann Arbor, MI (US); and Srivathsan Sudhakar, West Lafayette, IN (US)
Assigned to TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., Plano, TX (US); and PURDUE RESEARCH FOUNDATION, West Lafayette, IN (US)
Filed by Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US); and Purdue Research Foundation, West Lafayette, IN (US)
Filed on Jul. 8, 2022, as Appl. No. 17/860,507.
Application 17/860,507 is a continuation of application No. 16/560,230, filed on Sep. 4, 2019, granted, now 11,415,370.
Prior Publication US 2022/0341668 A1, Oct. 27, 2022
Int. Cl. F28B 1/02 (2006.01); F28F 3/02 (2006.01); H01L 23/427 (2006.01); F28D 15/06 (2006.01); F28D 15/02 (2006.01)
CPC F28B 1/02 (2013.01) [F28F 3/02 (2013.01); H01L 23/427 (2013.01); F28D 15/025 (2013.01); F28D 15/0233 (2013.01); F28D 15/0266 (2013.01); F28D 15/06 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A cooling system comprising:
an expandable vapor chamber comprising:
a condenser side opposite an evaporator side;
a condenser side wick coupled to a condenser side wall;
an evaporator side wick coupled to an evaporator side wall; and
a vapor core positioned between the evaporator side wick and the condenser side wick, wherein the condenser side wall comprises a thermal shape-memory polymer having a transition temperature that passively transitions the vapor chamber between a retracted position and an expanded position.
 
9. A cooling system comprising:
an expandable vapor chamber comprising:
a condenser side opposite an evaporator side;
a condenser side wick coupled to a condenser side wall;
an evaporator side wick coupled to an evaporator side wall; and
a vapor core positioned between the evaporator side wick and the condenser side wick, wherein the condenser side wall comprises a thermal shape-memory polymer having a transition temperature such that:
when the thermal shape-memory polymer comprises a temperature below the transition temperature, the evaporator side wall is in a retracted position and the vapor core comprises a first volume; and
when the thermal shape-memory polymer comprises a temperature above the transition temperature, the evaporator side wall is in an expanded position and the vapor core comprises a second volume that is greater than the first volume.