CPC F28B 1/02 (2013.01) [F28F 3/02 (2013.01); H01L 23/427 (2013.01); F28D 15/025 (2013.01); F28D 15/0233 (2013.01); F28D 15/0266 (2013.01); F28D 15/06 (2013.01)] | 16 Claims |
1. A cooling system comprising:
an expandable vapor chamber comprising:
a condenser side opposite an evaporator side;
a condenser side wick coupled to a condenser side wall;
an evaporator side wick coupled to an evaporator side wall; and
a vapor core positioned between the evaporator side wick and the condenser side wick, wherein the condenser side wall comprises a thermal shape-memory polymer having a transition temperature that passively transitions the vapor chamber between a retracted position and an expanded position.
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9. A cooling system comprising:
an expandable vapor chamber comprising:
a condenser side opposite an evaporator side;
a condenser side wick coupled to a condenser side wall;
an evaporator side wick coupled to an evaporator side wall; and
a vapor core positioned between the evaporator side wick and the condenser side wick, wherein the condenser side wall comprises a thermal shape-memory polymer having a transition temperature such that:
when the thermal shape-memory polymer comprises a temperature below the transition temperature, the evaporator side wall is in a retracted position and the vapor core comprises a first volume; and
when the thermal shape-memory polymer comprises a temperature above the transition temperature, the evaporator side wall is in an expanded position and the vapor core comprises a second volume that is greater than the first volume.
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