CPC B81C 1/00476 (2013.01) [B81C 1/00595 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81C 2201/014 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/053 (2013.01)] | 16 Claims |
1. An integrated MEMS transducer device comprising:
a substrate body having a first electrode on a substrate;
an etch stop layer located on a surface of the substrate;
a suspended micro-electro-mechanical systems (MEMS) diaphragm with a second electrode;
an anchor structure with anchors connecting the MEMS diaphragm to the substrate body; and
a sacrificial layer in between the anchors of the anchor structure, the sacrificial layer comprising:
a first sub-layer of a first material, wherein the first sub-layer is arranged on the etch stop layer, and
a second sub-layer of a second material, wherein the second sub-layer is arranged on the first sub-layer, and
wherein the first and the second material are different materials.
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