US 11,878,477 B2
Temperature control apparatus and temperature control method
Noriyuki Unno, Yamaguchi-ken (JP); and Kazuhisa Yuki, Yamaguchi-ken (JP)
Assigned to SANYO-ONODA CITY PUBLIC UNIVERSITY CORPORATION, Yamaguchi (JP); and PACRAFT CO., LTD., Tokyo (JP)
Filed by Sanyo-Onoda City Public University Corporation, Yamaguchi (JP); and PACRAFT Co., Ltd., Tokyo (JP)
Filed on Oct. 19, 2021, as Appl. No. 17/505,469.
Claims priority of application No. 2020-180818 (JP), filed on Oct. 28, 2020; and application No. 2021-163034 (JP), filed on Oct. 1, 2021.
Prior Publication US 2022/0126524 A1, Apr. 28, 2022
Int. Cl. B29C 65/00 (2006.01)
CPC B29C 66/9141 (2013.01) [B29C 66/8145 (2013.01); B29C 66/8181 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A temperature control apparatus comprising:
a first pressure bonding unit including a first flow passage and a first pressure bonding surface that is configured to be brought into contact with an object;
a temperature control fluid supply device configured to supply a temperature control fluid in form of a gas to the first flow passage in such a manner that the temperature control fluid is condensed on an inner wall surface of the first pressure bonding unit that partitions the first flow passage to adjust the first pressure bonding surface to a first heating temperature; and
a controller configured to operate a pressure adjustment device to lower an internal pressure of the first flow passage to place the first flow passage in a vacuum state so as to promote vaporization of the temperature control fluid in form of liquid in the first flow passage in such a manner that the first pressure bonding surface is adjusted to a temperature lower than the first heating temperature.