US 11,878,359 B2
Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot
Georg Pietsch, Burghausen (DE)
Assigned to Siltronic AG, Munich (DE)
Appl. No. 16/483,678
Filed by SILTRONIC AG, Munich (DE)
PCT Filed Jan. 30, 2018, PCT No. PCT/EP2018/052207
§ 371(c)(1), (2) Date Aug. 5, 2019,
PCT Pub. No. WO2018/149631, PCT Pub. Date Aug. 23, 2018.
Claims priority of application No. 102017202314.7 (DE), filed on Feb. 14, 2017.
Prior Publication US 2020/0016671 A1, Jan. 16, 2020
Int. Cl. B23D 57/00 (2006.01); B23D 61/18 (2006.01); B28D 5/04 (2006.01)
CPC B23D 57/0061 (2013.01) [B23D 57/0053 (2013.01); B23D 61/185 (2013.01); B28D 5/045 (2013.01)] 11 Claims
OG exemplary drawing
1. A method for simultaneously cutting a multiplicity of wafers from an ingot, comprising:
moving the ingot through a wire web of a structured sawing wire having a longitudinal direction and consisting of a single strand of a plain core wire having a round cross-section and a multiplicity of indentations and protrusions of the plain core wire perpendicular to the longitudinal direction of the plain core wire, the outer radial extent of the indentations and protrusions defining a cross-sectional envelope of the structured sawing wire,
wherein the structured sawing wire is spanned between two co-rotating wire guide rolls having grooves, and an abrasive slurry is applied to the wire web, and
wherein the grooves of the two co-rotating wire guide rolls have groove bottoms, and wherein the bottom of each groove on which the structured sawing wire bears is curved with a radius of curvature is equal to or up to 1.5 times as large as the radius of the cross-sectional envelope the structured sawing wire which is in the respective groove.