US 11,878,320 B2
Powder layer composite, coating film, powder coating method, and powder coating apparatus
Motohiro Okochi, Osaka (JP); Akihiro Horikawa, Osaka (JP); and Toshiyuki Kojima, Kyoto (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Aug. 6, 2021, as Appl. No. 17/396,645.
Claims priority of application No. 2020-155855 (JP), filed on Sep. 16, 2020.
Prior Publication US 2022/0080434 A1, Mar. 17, 2022
Int. Cl. B05B 7/00 (2006.01); B05B 7/14 (2006.01); B05B 5/025 (2006.01); B05B 17/06 (2006.01); C08L 33/08 (2006.01)
CPC B05B 7/144 (2013.01) [B05B 5/0255 (2013.01); B05B 17/0607 (2013.01); C08L 33/08 (2013.01)] 13 Claims
OG exemplary drawing
1. A powder layer composite comprising:
a base; and
a powder layer consisting of at least one non-conducting material, and having a thickness of 100 μm or less and disposed on the base, wherein
an average of a total value of a number of powder aggregates having a long diameter of 500 μm or greater and a number of pinholes having a long diameter of 500 μm or greater, in any of a plurality of different regions of 20 mm×20 mm on a surface of the powder layer, is 0.2 pieces/cm2 or less.