US 12,207,446 B2
Adjustable retention device for heat sink assembly
Mehdi Hamid Vishkasougheh, Rochester, MN (US); Kevin O'Connell, Rochester, MN (US); Eric J. Campbell, Rochester, MN (US); Arshad Alfoqaha, Eden Prairie, MN (US); and Connor L. Smith, Austin, TX (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION
Filed on Aug. 2, 2022, as Appl. No. 17/816,767.
Prior Publication US 2024/0049432 A1, Feb. 8, 2024
Int. Cl. H05K 7/20 (2006.01); H01L 23/40 (2006.01)
CPC H05K 7/2049 (2013.01) [H01L 23/4093 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A heat sink retention device for retaining a heat sink, including a spring, proximate an electronic device in a circuit board, the heat sink retention device comprising:
a first component configured to be attached to the circuit board; and
a second component configured to be adjustably attached to the first component, and including an opening configured to retain a portion of the spring of the heat sink, and at least one leg that is adapted to allow each of the at least one leg to be slidably inserted into at least one lumen in the first component and lock into place in order to adjustably attach the first and the second components together,
wherein when the first and second components are attached together and the first component is attached to the circuit board, the heat sink retention device is adapted to allow application of a force on the spring in order to retain the heat sink proximate an electronic device mounted on the circuit board.