US 12,207,444 B2
Systems and methods for an electronic device
David Jia, Canton, MI (US); Jianing Chen, Northville, MI (US); and Jon Curry, Commerce Township, MI (US)
Assigned to HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED, Stamford, CT (US)
Filed by Harman International Industries, Incorporated, Stamford, CT (US)
Filed on Aug. 9, 2022, as Appl. No. 17/818,657.
Prior Publication US 2024/0057292 A1, Feb. 15, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 5/02 (2006.01); H05K 5/04 (2006.01); H05K 7/14 (2006.01); H05K 9/00 (2006.01)
CPC H05K 7/20409 (2013.01) [H05K 1/0201 (2013.01); H05K 5/0213 (2013.01); H05K 5/04 (2013.01); H05K 7/1405 (2013.01); H05K 7/20136 (2013.01); H05K 7/20854 (2013.01); H05K 9/0041 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic package for a vehicle comprising:
a chassis having a plurality of bent tabs forming a plurality of respective vent openings in the chassis; and
a circuit board coupled to the chassis,
wherein the bent tabs directly contact the circuit board, and
wherein the bent tabs only bend inward in a direction of an interior of the chassis.