US 12,207,405 B2
Beveled overburden for vias and method of making the same
Dhananjay Joshi, Painted Post, NY (US); Chukwudi Azubuike Okoro, Painted Post, NY (US); and Scott Christopher Pollard, Big Flats, NY (US)
Assigned to Corning Incorporated, Corning, NY (US)
Appl. No. 17/923,624
Filed by CORNING INCORPORATED, Corning, NY (US)
PCT Filed Apr. 29, 2021, PCT No. PCT/US2021/029776
§ 371(c)(1), (2) Date Nov. 7, 2022,
PCT Pub. No. WO2021/225850, PCT Pub. Date Nov. 11, 2021.
Claims priority of provisional application 63/021,891, filed on May 8, 2020.
Prior Publication US 2023/0380062 A1, Nov. 23, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 3/06 (2006.01); H05K 3/42 (2006.01)
CPC H05K 1/116 (2013.01) [H05K 1/0306 (2013.01); H05K 3/064 (2013.01); H05K 3/42 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09154 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09845 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A substrate, comprising:
a first surface, a second surface opposite the first surface, and a via passing from the first surface to the second surface; and
a metallic layer coating the via,
wherein the metallic layer comprises a first beveled overburden on the first surface and the first beveled overburden comprises first outer edge,
wherein the first outer edge forms a first bevel angle greater than 95° with the first surface,
wherein the substrate exhibits a lower probability of crack formation when heated to temperatures less than or equal to 600° C. than a substrate having an equivalent metallic layer with a patterned overburden.