US 12,207,401 B2
Embedded smart module
Syang-Peng Rwei, Taipei (TW); Yuan-Fu Cheng, Taipei (TW); and Lih Jen Kau, Taipei (TW)
Assigned to National Taipel University of Technology, Taipei (TW)
Filed by National Taipei University of Technology, Taipei (TW)
Filed on Oct. 10, 2022, as Appl. No. 17/963,188.
Claims priority of application No. 111135243 (TW), filed on Sep. 16, 2022.
Prior Publication US 2024/0098893 A1, Mar. 21, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01)
CPC H05K 1/0393 (2013.01) [H05K 1/028 (2013.01); H05K 1/038 (2013.01); H05K 1/05 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An embedded smart module, comprising:
a twistable substrate;
an electrode layer, disposed on the twistable substrate;
a circuit layer, disposed in the electrode layer and exposed at the surface of the electrode layer;
an insulating layer, disposed between the electrode layer and the circuit layer;
an electronic component, disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer; and
a sensing component, disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer.