US 12,207,392 B2
Electronic component comprising first and second conductive traces and a void formed in an insulative layer between the first and second traces providing crosstalk reduction
Matthew Doyle, Chatfield, MN (US); David Clifford Long, Wappingers Falls, NY (US); Matteo Cocchini, New York, NY (US); Russell A. Budd, North Salem, NY (US); James Busby, New Paltz, NY (US); Roger S. Krabbenhoft, Rochester, MN (US); and Arthur J. Higby, Cottekill, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Sep. 20, 2022, as Appl. No. 17/933,693.
Prior Publication US 2024/0098882 A1, Mar. 21, 2024
Int. Cl. H05K 1/02 (2006.01); H01P 3/08 (2006.01); H01P 11/00 (2006.01)
CPC H05K 1/0228 (2013.01) [H01P 3/081 (2013.01); H01P 11/003 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a first trace configured to transmit a first signal;
a second trace configured to transmit a second signal;
a layer of conductive material separated from the first and second traces by a layer of insulative material;
a first vertical wall formed in direct contact with and perpendicular to the layer of conductive material; and
a second vertical wall formed in direct contact with and perpendicular to the layer of conductive material, wherein:
the second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.