US 12,207,052 B2
MEMS structure
Chun-Kai Mao, Tainan (TW); Chih-Yuan Chen, Tainan (TW); Feng-Chia Hsu, Tainan (TW); Jien-Ming Chen, Tainan (TW); Wen-Shan Lin, Tainan (TW); and Nai-Hao Kuo, Tainan (TW)
Assigned to FORTEMEDIA, INC., Alviso, CA (US)
Filed by Fortemedia, Inc., Santa Clara, CA (US)
Filed on Oct. 3, 2022, as Appl. No. 17/937,477.
Claims priority of provisional application 63/325,750, filed on Mar. 31, 2022.
Prior Publication US 2023/0319486 A1, Oct. 5, 2023
Int. Cl. H04R 19/04 (2006.01); B81B 3/00 (2006.01); H04R 7/04 (2006.01); H04R 7/18 (2006.01)
CPC H04R 19/04 (2013.01) [B81B 3/0072 (2013.01); H04R 7/04 (2013.01); H04R 7/18 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); H04R 2201/003 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A micro-electro-mechanical system structure, comprising:
a substrate having an opening portion;
a backplate disposed on one side of the substrate;
a diaphragm disposed between the substrate and the backplate, wherein the opening portion of the substrate is under the diaphragm, and an air gap is formed between the diaphragm and the backplate;
a pillar structure connected with the backplate and the diaphragm; and
a protection post structure and a plurality of dimples extending from the backplate into the air gap,
wherein from a top view of the backplate, the protection post structure surrounds the pillar structure, and a distance between the dimples and the diaphragm is greater than a distance between the protection post structure and the diaphragm.