US 12,207,029 B2
Heat dissipating device
Hui-Liang Chen, Hsinchu (TW)
Assigned to Hitron Technologies Inc., Hsinchu (TW)
Filed by Hitron Technologies Inc., Hsinchu (TW)
Filed on Oct. 3, 2022, as Appl. No. 17/937,460.
Prior Publication US 2024/0114268 A1, Apr. 4, 2024
Int. Cl. H05K 7/20 (2006.01); H04Q 1/02 (2006.01)
CPC H04Q 1/035 (2013.01) [H05K 7/2039 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A heat dissipating device, comprising:
a heat generating unit, which generates heat when under operation and is placed at a first side of the heat dissipating device;
a heat sensitive object, which is placed at a second side of the heat dissipating device; and
an air layer, which is arranged in a compartment between the first side and the second side of the heat dissipating device, wherein the compartment is defined by a top wall, a bottom wall opposing the top wall, and internal isolation boards contacting both the top wall and the bottom wall, and each of the top wall and the bottom wall includes a plurality of vents;
wherein the heat generated by the heat generating unit is isolated from the heat sensitive object by the air layer, and the heat is dissipated through the plurality of vents on the top wall by convection of the air layer when the heat dissipating device stands upright.