US 12,206,184 B2
Antenna package and image display device including the same
Byung Jin Choi, Incheon (KR); Na Yeon Kim, Seoul (KR); Young Ju Kim, Gyeonggi-do (KR); and Won Bin Hong, Seoul (KR)
Assigned to DONGWOO FINE-CHEM CO., LTD., Jeollabuk-do (KR); and POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION, Gyeongsangbuk-do (KR)
Filed by DONGWOO FINE-CHEM CO., LTD., Jeollabuk-do (KR); and POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION, Gyeongsangbuk-do (KR)
Filed on Oct. 31, 2022, as Appl. No. 17/977,205.
Application 17/977,205 is a continuation of application No. PCT/KR2021/005422, filed on Apr. 29, 2021.
Claims priority of application No. 10-2020-0052083 (KR), filed on Apr. 29, 2020.
Prior Publication US 2023/0052259 A1, Feb. 16, 2023
Int. Cl. H01Q 5/35 (2015.01); H01Q 1/24 (2006.01); H01Q 9/04 (2006.01)
CPC H01Q 5/35 (2015.01) [H01Q 1/241 (2013.01); H01Q 9/0407 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An antenna package, comprising:
an antenna unit comprising a radiator, a transmission line extending from the radiator and an antenna ground pad disposed around the transmission line; and
a circuit board electrically connected to the antenna unit, the circuit board comprising:
a core layer;
a circuit wiring layer disposed on one surface of the core layer, the circuit wiring layer comprising a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad; and
a ground layer disposed on an opposite surface facing the one surface of the core layer, wherein the ground layer does not overlap a portion of the antenna ground pad except for a region bonded to the first ground pattern in a planar view,
wherein the antenna ground pad includes a bonding region bonded to the first ground pattern and a non-bonding region that does not overlap the first ground pattern in the planar view.