| CPC H01Q 21/22 (2013.01) [H01Q 1/243 (2013.01); H01Q 1/42 (2013.01); H01Q 3/34 (2013.01); H01Q 5/50 (2015.01)] | 3 Claims |
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1. An electronic device comprising:
a dielectric overmold;
a dielectric resonating element embedded in the dielectric overmold, wherein the dielectric resonating element has a longitudinal axis, a first surface at a first end of the longitudinal axis, a second surface at the second end of the longitudinal axis, and sidewalls extending orthogonally from the first surface to the second surface, and at least a portion of the sidewalls is covered by the dielectric overmold;
a first feed probe coupled to a first location on the sidewalls, wherein the first feed probe is configured to excite a first volume of the dielectric resonating element extending from the first location to the first end to radiate, through the first end, at frequencies greater than 10 GHZ, and at least a portion of the first feed probe is covered by the dielectric overmold;
a second feed probe coupled to a second location on the sidewalls that is interposed between the first location on the sidewalls and the second end of the dielectric resonating element, wherein the second feed probe is configured to excite a second volume of the dielectric resonating element extending from the second location to the second end to radiate, through the second end, at frequencies greater than 10 GHZ, and at least a portion of the second feed probe is covered by the dielectric overmold; and
a notch in the sidewalls between the first location on the sidewalls and the second location on the sidewalls.
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