US 12,206,165 B2
Semiconductor device package and method of manufacturing the same
Shao-En Hsu, Kaohsiung (TW); Huei-Shyong Cho, Kaohsiung (TW); and Shih-Wen Lu, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jun. 6, 2023, as Appl. No. 18/206,580.
Application 18/206,580 is a continuation of application No. 17/327,644, filed on May 21, 2021, granted, now 11,670,846.
Application 17/327,644 is a continuation of application No. 16/448,990, filed on Jun. 21, 2019, granted, now 11,018,422, issued on May 25, 2021.
Prior Publication US 2023/0327333 A1, Oct. 12, 2023
Int. Cl. H01Q 1/52 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 1/48 (2006.01); H01Q 5/378 (2015.01); H01Q 21/06 (2006.01)
CPC H01Q 1/523 (2013.01) [H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 1/48 (2013.01); H01Q 5/378 (2015.01); H01Q 21/061 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device package comprising:
a first antenna comprising a first portion and a second portion spaced apart from and electrically coupled to the first portion for signal transmission, wherein a thickness of the first portion is substantially the same as a thickness of the second portion in a cross-sectional view perspective;
a second antenna disposed over the first antenna; and
a third antenna disposed over the second antenna and configured to electrically couple to the second antenna.