CPC H01Q 1/44 (2013.01) [H01Q 1/02 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/241 (2013.01); H01Q 1/526 (2013.01); H01Q 9/30 (2013.01); H01Q 21/28 (2013.01); H01Q 23/00 (2013.01); H01Q 1/2266 (2013.01); H01Q 1/50 (2013.01)] | 20 Claims |
1. An information handling system eating having a converged 5G antenna module comprising:
a processor;
a memory;
a power management unit (PMU);
a wireless interface adapter configured to receive instructions to concurrently excite the converged 5G antenna module at a new radio frequency range 1 (NRFR1) frequency and a NRFR2 frequency;
the converged 5G antenna module including a cooling element structure and a millimeter wave (mmWave) antenna on a mmWave antenna printed circuit board (PCB) operatively coupled to the cooling element structure via a shielding layer disposed between the antenna PCB and the cooling element structure;
a first radio subsystem with a first antenna front end operatively coupled to the mmWave antenna PCB of the converged 5G antenna module configured to transceive an NRFR2 wireless communication signal via the mmWave antenna of the converged 5G antenna module;
a liquid crystal polymer (LCP) adaptor flexible cable operatively coupling the mmWave antenna PCB of the converged 5G antenna module with the first radio subsystem;
a second radio subsystem with a second front end operatively coupled to the cooling element structure formed of metal to transmit an NRFR1 wireless communication signal via signal excitation of the metal of the cooling element structure by the second radio subsystem of the converged 5G antenna module and configured to receive the NRFR1 wireless communication signal via the cooling element structure to be detected by the second radio subsystems via a radiofrequency feed, where the cooling element structure forms a cooling element antenna of the converged 5G antenna module; and
the shielding layer to shield the first radio subsystem with the first antenna front end from the mmWave antenna and the cooling element antenna formed of the cooling element structure and thermally couple the mmWave antenna PCB to the cooling element structure, wherein the LCP adaptor flexible cable is operatively coupled to the mmWave antenna PCB through the shielding layer.
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