| CPC H01P 7/10 (2013.01) [H01P 7/065 (2013.01); H01P 11/008 (2013.01); H03B 5/1206 (2013.01)] | 30 Claims |
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1. A device, comprising:
a surface-mounted integrated circuit package housing an active oscillator circuit; and
an integrated ceramic resonator formed from a ceramic substrate having an upper planar surface receiving the surface-mounted integrated circuit package, the integrated ceramic resonator including
a plurality of conductive walls forming a conductive periphery of a ceramic cavity in the ceramic substrate,
a conductive rod extending vertically at least partially into the ceramic cavity, wherein the conductive rod is isolated from contact with the conductive periphery of the ceramic cavity,
a first conductive material extending vertically through the upper planar surface of the ceramic substrate for connecting the conductive periphery of the ceramic cavity to the surface-mounted integrated circuit package housing the active oscillator circuit, and
a second conductive material extending through the upper planar surface of the ceramic substrate for connecting the conductive rod to the surface-mounted integrated circuit package housing the active oscillator circuit.
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