US 12,206,154 B2
Compact high-directivity directional coupler structure using interdigitated coupled lines
Anirban Sarkar, San Jose, CA (US); Tienyu Chang, Sunnyvale, CA (US); Siuchuang Ivan Lu, San Jose, CA (US); and Sang Won Son, Palo Alto, CA (US)
Assigned to Samsung Electronics Co., Ltd, (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Feb. 28, 2023, as Appl. No. 18/115,327.
Application 18/115,327 is a continuation of application No. 17/462,580, filed on Aug. 31, 2021, granted, now 11,621,470.
Claims priority of provisional application 63/144,730, filed on Feb. 2, 2021.
Prior Publication US 2023/0208005 A1, Jun. 29, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01P 5/18 (2006.01); H01P 1/18 (2006.01); H01Q 23/00 (2006.01)
CPC H01P 5/187 (2013.01) [H01P 1/18 (2013.01); H01P 5/186 (2013.01); H01Q 23/00 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A device, comprising:
a first line;
a second line including a first section disposed on a first side of the first line and a second section disposed on a second side of the first line, the second side being opposite to the first side and the second section being separate from the first section by a distance; and
at least one bridge electrically connecting an end of the first section with an end of the second section and extending across the first line,
wherein a width of the first line and a width of the first section and the second section of the second line are set to modify one of a plurality of coupled line parameters.