US 12,206,060 B2
Lead frame assembly and chip packaging device
Chia-Neng Huang, Kaohsiung (TW)
Assigned to CHANG WAH TECHNOLOGY CO., LTD., Kaohsiung (TW)
Filed by CHANG WAH TECHNOLOGY CO., LTD., Kaohsiung (TW)
Filed on May 31, 2022, as Appl. No. 17/828,567.
Claims priority of application No. 110213701 (TW), filed on Nov. 18, 2021.
Prior Publication US 2023/0155091 A1, May 18, 2023
Int. Cl. H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 33/38 (2010.01); H01L 33/54 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/38 (2013.01); H01L 33/54 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A lead frame assembly, comprising:
a frame; and
a plurality of lead frame units arranged in an array and made of an electrically conductive material, said array of said lead frame units includes a plurality of rows each extending along a first direction and a plurality of columns each extending along a second direction,
said lead frame units being connected to one another within said frame and each including
a chip holder having a first electrode pad and a second electrode pad which are electrically independent of each other and which are spaced apart from each other along the first direction, and
a pin unit having
at least one first pin extending along the first direction from a side edge of said first electrode pad distal from said second electrode pad,
at least one second pin extending along the first direction from a side edge of said second electrode pad distal from said first electrode pad, and
a plurality of third pins extending along a second direction perpendicular to the first direction from a side edge of said first electrode pad and a side edge of said second electrode pad;
wherein
an arrangement of said first and second electrode pads in each of said lead frame units is opposite to that of said first and second electrode pads in an adjacent one of said lead frame units along the second direction,
said first electrode pads or said second electrode pads of said chip holders of two adjacent ones of said lead frame units in each of the rows are adjacent to each other along the first direction,
said first electrode pad and said second electrode pad in each of said lead frame units respectively have pin-free side edges opposite to said side edges formed with said third pins,
said pin unit extending from one of said lead frame units is connected to said pin unit of said adjacent one of said lead frame units, and
for said lead frame units disposed adjacent to said frame, said pin units extending towards said frame are connected to said frame such that said lead frame units are fixedly positioned within said frame.