US 12,205,998 B2
Semiconductor device with wrap around silicide and hybrid fin
Shih-Cheng Chen, Hsinchu (TW); Zhi-Chang Lin, Hsinchu (TW); Jung-Hung Chang, Hsinchu (TW); Chien-Ning Yao, Hsinchu (TW); Tsung-Han Chuang, Hsinchu (TW); Kuo-Cheng Chiang, Hsinchu (TW); and Chih-Hao Wang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jan. 14, 2022, as Appl. No. 17/576,748.
Claims priority of provisional application 63/214,665, filed on Jun. 24, 2021.
Prior Publication US 2022/0416036 A1, Dec. 29, 2022
Int. Cl. H01L 29/417 (2006.01); H01L 21/762 (2006.01); H01L 27/088 (2006.01); H01L 29/66 (2006.01)
CPC H01L 29/41733 (2013.01) [H01L 21/76224 (2013.01); H01L 27/088 (2013.01); H01L 29/66742 (2013.01)] 20 Claims
OG exemplary drawing
 
18. A device, comprising:
a substrate;
a first transistor on the substrate, the first transistor including a plurality of first semiconductor nanostructures corresponding to a channel region of the first transistor;
a second transistor on the substrate, the second transistor including a plurality of second semiconductor nanostructures corresponding to a channel region of the second transistor;
a source/drain region in contact with the plurality of first semiconductor nanostructures and the plurality of second semiconductor nanostructures along a first direction;
a first dielectric fin structure and a second dielectric fin structure adjacent to opposite sides of the source/drain region along a second direction that is transverse to the first direction, each of the first and second dielectric fin structures including a respective upper surface, a lower surface, and an intermediate surface that is disposed between the upper and lower surfaces; and
a silicide layer on a top surface and side surfaces of the source/drain region, the silicide layer disposed on the intermediate surfaces of each of the first and second dielectric fin structures.